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HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Data Sheet September 2003 FN3980.15
+5V Powered RS-232 Transmitters/Receivers with 0.1Microfarad External Capacitors
The HIN202, HIN206, HIN207, HIN208, HIN211, HIN213 family of RS-232 transmitters/receivers interface circuits meet all ElA RS-232E and V.28 specifications, and are particularly suited for those applications where 12V is not available. They require a single +5V power supply and feature onboard charge pump voltage converters which generate +10V and -10V supplies from the 5V supply The family of devices offers a wide variety of RS-232 transmitter/receiver combinations to accommodate various applications (see Selection Table). The HIN206, HIN211 and HIN213 feature a low power shutdown mode to conserve energy in battery powered applications. In addition, the HIN213 provides two active receivers in shutdown mode allowing for easy "wakeup" capability. The drivers feature true TTL/CMOS input compatibility, slew rate-limited output, and 300 power-off source impedance. The receivers can handle up to 30V input, and have a 3k to 7k input impedance. The receivers also feature hysteresis to greatly improve noise rejection.
Features
* Meets All RS-232E and V.28 Specifications * Requires Only 0.1F or Greater External Capacitors * High Data Rate. . . . . . . . . . . . . . . . . . . . . . . . . . .120kbit/s * Two Receivers Active in Shutdown Mode (HIN213) * Requires Only Single +5V Power Supply * Onboard Voltage Doubler/Inverter * Low Power Consumption (Typ) . . . . . . . . . . . . . . . . . 5mA * Low Power Shutdown Function (Typ) . . . . . . . . . . . . .1A * Three-State TTL/CMOS Receiver Outputs * Multiple Drivers - 10V Output Swing for +5V lnput - 300 Power-Off Source Impedance - Output Current Limiting - TTL/CMOS Compatible - 30V/s Maximum Slew Rate * Multiple Receivers - 30V Input Voltage Range - 3k to 7k Input Impedance - 0.5V Hysteresis to Improve Noise Rejection
Applications
* Any System Requiring RS-232 Communications Port - Computer - Portable, Mainframe, Laptop - Peripheral - Printers and Terminals - Instrumentation - Modems
Selection Table
PART NUMBER HIN202 HIN206 HIN207 HIN208 HIN211 HIN213 POWER SUPPLY VOLTAGE +5V +5V +5V 5V +5V +5V NUMBER OF RS-232 DRIVERS 2 4 5 4 4 4 NUMBER OF RS-232 RECEIVERS 2 3 3 4 5 5 NUMBER OF 0.1F EXTERNAL CAPACITORS 4 Capacitors 4 Capacitors 4 Capacitors 4 Capacitors 4 Capacitors 4 Capacitors LOW POWER SHUTDOWN/TTL THREE-STATE No/No Yes/Yes No/No No/No Yes/Yes Yes/Yes NUMBER OF RECEIVERS ACTIVE IN SHUTDOWN 0 0 0 0 0 2
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright (c) Intersil Americas Inc. 2003. All Rights Reserved. All other trademarks mentioned are the property of their respective owners.
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213 Ordering Information
PART NO. HIN202CB HIN202CB-T HIN202CBN HIN202CBN-T HIN202CP HIN202IB HIN202IBN HIN206CB HIN207CA HIN207CB TEMP. RANGE (oC) 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 -40 to 85 -40 to 85 0 to 70 0 to 70 0 to 70 PACKAGE 16 Ld SOIC (W) 16 Ld SOIC (W) Tape and Reel 16 Ld SOIC (N) 16 Ld SOIC (N) Tape and Reel 16 Ld PDIP 16 Ld SOIC (W) 16 Ld SOIC (N) 24 Ld SOIC 24 Ld SSOP 24 Ld SOIC PKG. DWG. # M16.3 M16.3 HIN208CB M16.15 M16.15 HIN211CA E16.3 M16.3 HIN211CB M16.15 HIN211CB-T M24.3 M24.209 M24.3 HIN213CA HIN213CA-T 0 to 70 0 to 70 0 to 70 28 Ld SOIC Tape and Reel 28 Ld SSOP 28 Ld SSOP Tape and Reel M28.3 M28.209 M28.209 0 to 70 28 Ld SOIC M28.3 HIN211CA-T 0 to 70 0 to 70 28 Ld SSOP 28 Ld SSOP Tape and Reel M28.209 M28.209 HIN208CB-T 0 to 70 0 to 70 24 Ld SOIC 24 Ld SOIC Tape and Reel M24.3 M24.3
Ordering Information (Continued)
PART NO. HIN207CB-T TEMP. RANGE (oC) 0 to 70 PACKAGE 24 Ld SOIC Tape and Reel PKG. DWG. # M24.3
Pin Descriptions
PIN VCC V+ VGND C1+ C1C2+ C2TIN TOUT RIN ROUT EN, EN SD, SD NC Power Supply Input 5V 10%, (5V 5% HIN207). Internally generated positive supply (+10V nominal). Internally generated negative supply (-10V nominal). Ground Lead. Connect to 0V. External capacitor (+ terminal) is connected to this lead. External capacitor (- terminal) is connected to this lead. External capacitor (+ terminal) is connected to this lead. External capacitor (- terminal) is connected to this lead. Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400k pull-up resistor to VCC is connected to each lead. Transmitter Outputs. These are RS-232 levels (nominally 10V). Receiver Inputs. These inputs accept RS-232 input levels. An internal 5k pull-down resistor to GND is connected to each input. Receiver Outputs. These are TTL/CMOS levels. Receiver enable Input. With EN = 5V (HIN213 EN = 0V), the receiver outputs are placed in a high impedance state. Shutdown Input. With SD = 5V (HIN213 SD = 0V), the charge pump is disabled, the receiver outputs are in a high impedance state (except R4 and R5 of HIN213) and the transmitters are shut off. No Connect. No connections are made to these leads. FUNCTION
2
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213 Pinouts
HIN202 (PDIP, SOIC) TOP VIEW
1 2 3 4 5 6 7 8 9
HIN206 (SOIC) TOP VIEW
24 T4OUT 23 R2IN 22 R2OUT 21 SD 20 EN 19 T4IN 18 T3IN 17 R3OUT 16 R3IN 15 V14 C213 C2+
C1+ 1 V+ 2 C1- 3 C2+ 4 C2- 5 V6
16 VCC 15 GND 14 T1OUT 13 R1IN 12 R1OUT 11 T1IN 10 T2IN 9 R2OUT
T3OUT T1OUT T2OUT R1IN R1OUT T2IN T1IN GND VCC
T2OUT 7 R2IN 8
C1+ 10 V+ 11 C1- 12
+5V 10 C1+ + 12 C113 C2+ + 14 C2-
+5V 9 VCC +5V TO 10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER T1 V+ 0.1F
16
0.1F
11
+
1 0.1F + 3 4 0.1F + 5
VCC C1+ C1C2+ C2+5V TO 10V VOLTAGE INVERTER V+ 2 + 0.1F 0.1F
V- 15 + 2 0.1F T1OUT
+10V TO -10V VOLTAGE INVERTER
V- 6 + 0.1F
T1IN
+5V 400k 7 +5V 400k +5V 400k
T2 3 T3 T2OUT
T2IN T1OUT
6
T1IN
11
+5V 400k
T1
14
T3IN T4IN R1OUT
18
1
T3OUT T4OUT R1IN
T2IN
10 12
+5V 400k
T2 7 13 R1IN R1 5k T2OUT
+5V 400k 19 5
T4 24 4 R1 5k 23 R2IN R2 5k 16 R3IN R3 5k 21 SD GND 8
R1OUT
22 R2OUT 9 R2 GND 15 5k 17 R3OUT 20 EN 8 R2OUT R2IN
3
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213 Pinouts
(Continued) HIN207 (SOIC, SSOP) TOP VIEW
T3OUT T1OUT T2OUT 1 2 3 24 T4OUT 23 R2IN 22 R2OUT 21 T5IN 20 T5OUT 19 T4IN 18 T3IN 17 R3OUT 16 R3IN 15 V14 C213 C2+
HIN208 (SOIC) TOP VIEW
T2OUT T1OUT R2IN R2OUT T1IN R1OUT R1IN GND VCC
1 2 3 4 5 6 7 8 9
24 T3OUT 23 R3IN 22 R3OUT 21 T4IN 20 T4OUT 19 T3IN 18 T2IN 17 R4OUT 16 R4IN 15 V14 C213 C2+
R1IN 4 R1OUT 5
T2IN 6 T1IN 7 GND VCC 8 9
C1+ 10 V+ 11 C1- 12
C1+ 10 V+ 11 C1- 12
+5V 9 0.1F 10 C1+ + 12 C113 C2+ + 14 C2VCC +5V TO 10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER T1 V+ 11 + 0.1F 0.1F 10 C1+ + 12 C113 C2+ + 14 C2-
+5V 9 VCC +5V TO 10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER T1 V+ 11 + 0.1F
0.1F
V- 15 + 2 0.1F T1OUT
0.1F
V- 15 + 2 0.1F T1OUT
T1IN
+5V 400k 7 +5V 400k +5V 400k
T1IN
+5V 400k 5 +5V 400k +5V 400k
T2 3 T3 T2OUT T2IN
T2 1 T3 T2OUT
T2IN
6
18
T3IN T4IN T5IN R1OUT
18
1
T3OUT T4OUT T5OUT R1IN
T3IN T4IN R1OUT
19
24
T3OUT T4OUT R1IN
+5V 400k 19 +5V 400k
T4 24 T5 20 4
+5V 400k 21 6
T4 20 7 R1 5k 3 R2IN R2 5k 23 R3IN R3 5k 16 R4IN R4 GND 5k
21 5
4 R2OUT
R1 22 R2OUT R2 17 R3OUT R3 GND 8
5k 23 R2IN 5k 16 R3IN 5k
22 R3OUT
17 R4OUT
8
4
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213 Pinouts
(Continued) HIN211 (SOIC, SSOP) TOP VIEW
T3OUT 1 T1OUT 2 T2OUT 3 R2IN 4 R2OUT 5 T2IN 6 T1IN 7 R1OUT 8 R1IN 9 GND 10 VCC 11 C1+ 12 V+ 13 C1- 14 28 T4OUT 27 R3IN 26 R3OUT 25 SD 24 EN 23 R4IN 22 R4OUT 21 T4IN 20 T3IN 19 R5OUT 18 R5IN 17 V16 C215 C2+ T3OUT 1 T1OUT 2 T2OUT 3 R2IN 4 R2OUT 5 T2IN 6 T1IN 7 R1OUT 8 R1IN 9 GND 10 VCC 11 C1+ 12 V+ 13 C1- 14
HIN213 (SSOP) TOP VIEW
28 T4OUT 27 R3IN 26 R3OUT 25 SD 24 EN 23 R4IN 22 R4OUT 21 T4IN 20 T3IN 19 R5OUT 18 R5IN 17 V16 C215 C2+
NOTE: R4 and R5 active in shutdown.
+5V 11 0.1F 12 C1+ + 14 C115 C2+ + 16 C2VCC +5V TO 10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER T1 V+ 13 + 0.1F 0.1F 12 C1+ + 14 C115 C2+ + 16 C2+5V 11 VCC +5V TO 10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER T1 V+ 13 + 0.1F
0.1F
V- 17 + 2 0.1F T1OUT
0.1F
V- 17 + 2 0.1F T1OUT
T1IN
+5V 400k 7 +5V 400k +5V 400k +5V 400k
T1IN
+5V 400k 7 +5V 400k +5V 400k +5V 400k
T2 3 T3 T2OUT T2IN 6
T2 3 T3 T2OUT
T2IN
6
T3IN
20
1
T3OUT
T3IN
20
1
T3OUT
T4IN R1OUT
21 8
T4
28 9
T4OUT R1IN
T4IN R1OUT
21 8
T4
28 9
T4OUT R1IN
R1 5 R2OUT R2 26 R3OUT R3 22 R4OUT R4 19 R5OUT 24 EN GND 10 R5
5k 4 R2IN 5k 27 R3IN 5k 23 R4IN 5k 18 R5IN 5k 25 SD EN 24 R5OUT 19 R4OUT 22 R3OUT 26 R2OUT 5
R1
5k 4 R2IN
R2
5k 27 R3IN
R3
5k 23 R4IN
R4
5k 18 R5IN
R5 GND 10
5k 25 SD
5
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Absolute Maximum Ratings
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) Thermal Information
Thermal Resistance (Typical, Note 1)
JA (oC/W)
16 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 90 16 Ld SOIC (N) Package . . . . . . . . . . . . . . . . . . . . . 110 16 Ld SOIC (W) Package. . . . . . . . . . . . . . . . . . . . . 100 24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 75 24 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 135 28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 70 28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 100 Maximum Junction Temperature (Plastic Package) . . . . . . . .150oC Maximum Storage Temperature Range . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC (SOIC and SSOP - Lead Tips Only)
Operating Conditions
Temperature Range HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC HIN2XXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: 1. JA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
PARAMETER SUPPLY CURRENTS Power Supply Current, ICC
Test Conditions: VCC = +5V 10%, (VCC = +5V 5%, HIN207); C1-C4 = 0.1F; TA = Operating Temperature Range TEST CONDITIONS MIN TYP MAX UNITS
No Load, TA = 25oC TA = 25oC
HIN202 HIN206, HIN207, HIN208, HIN211, HIN213 HIN206, HIN211 HIN213
-
8 11 1 15
15 20 10 50
mA mA A A
Shutdown Supply Current, ICC(SD)
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS Input Logic Low, VlL Input Logic High, VlH Transmitter Input Pullup Current, IP TTL/CMOS Receiver Output Voltage Low, VOL TTL/CMOS Receiver Output Voltage High, VOH TTL/CMOS Receiver Output Leakage RECEIVER INPUTS RS-232 Input Voltage Range, VIN Receiver Input Impedance, RIN Receiver Input Low Threshold, VIN (H-L) TA = 25oC, VIN = 3V VCC = 5V, TA = 25oC VCC = 5V, TA = 25oC Active Mode Shutdown Mode HIN213 R4 and R5 Active Mode Shutdown Mode HIN213 R4 and R5 -30 3.0 0.8 0.6 0.2 5.0 1.2 1.5 1.7 1.5 0.5 +30 7.0 2.4 2.4 1.0 V k V V V V V TIN , EN, SD, EN, SD TIN EN, SD, EN, SD TIN = 0V IOUT = 1.6mA (HIN202, IOUT = 3.2mA) IOUT = -1mA EN = VCC , EN = 0, 0V < ROUT < VCC 2.0 2.4 3.5 15 0.1 4.6 0.05 0.8 200 0.4 10 V V V A V V A
Receiver Input High Threshold, VIN (L-H)
Receiver Input Hysteresis, VHYST
VCC = 5V No Hysteresis in Shutdown Mode
6
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Electrical Specifications
PARAMETER TIMING CHARACTERISTICS Baud Rate Output Enable Time, tEN Output Disable Time, tDIS Transmitter, Receiver Propagation Delay, tPD 1 Transmitter Switching RL = 3k 120 3 400 200 0.5 0.5 0.5 40 10 10 30 kbps ns ns s s s V/s Test Conditions: VCC = +5V 10%, (VCC = +5V 5%, HIN207); C1-C4 = 0.1F; TA = Operating Temperature Range (Continued) TEST CONDITIONS MIN TYP MAX UNITS
HIN206, HIN211, HIN213 HIN206, HIN211, HIN213 HIN213 SD = 0V, R4, R5 HIN213 SD = VCC , R1 - R5 HIN202, HIN206, HIN207, HIN208, HIN211
Transition Region Slew Rate, SRT
RL = 3k, CL = 2500pF Measured from +3V to -3V or -3V to +3V, 1 Transmitter Switching (Note 2)
TRANSMITTER OUTPUTS Output Voltage Swing, TOUT Output Resistance, TOUT RS-232 Output Short Circuit Current, ISC NOTE: 2. Guaranteed by design. Transmitter Outputs, 3k to Ground VCC = V+ = V- = 0V, VOUT = 2V TOUT Shorted to GND 5 300 9 10 10 V mA
VOLTAGE DOUBLER S1 VCC + + C1 C3 VCC S3 RC OSCILLATOR C1S4 GND S7 C1+ S2 V+ = 2VCC S5
VOLTAGE INVERTER C2+ S6 GND + C2 + C4 V- = - (V+) C2S8
GND
-
-
-
FIGURE 1. CHARGE PUMP
7
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213 Detailed Description
The HIN202, HIN206, HIN207, HIN208, HIN211, HIN213 family of RS-232 transmitters/receivers are powered by a single +5V power supply feature low power consumption, and meet all ElA RS232C and V.28 specifications. The circuit is divided into three sections: The charge pump, transmitter, and receiver.
Receivers
The receiver inputs accept up to 30V while presenting the required 3k to 7k input impedance even if the power is off (VCC = 0V). The receivers have a typical input threshold of 1.3V which is within the 3V limits, known as the transition region, of the RS-232 specifications. The receiver output is 0V to VCC . The output will be low whenever the input is greater than 2.4V and high whenever the input is floating or driven between +0.8V and -30V. The receivers feature 0.5V hysteresis (except during shutdown) to improve noise rejection. The receiver Enable line (EN on HIN206 and HIN211, EN on HIN213) when unasserted, disables the receiver outputs, placing them in the high impedance mode. The receiver outputs are also placed in the high impedance state when in shutdown mode (except HIN213 R4 and R5).
V+ VCC 400k TXIN GND < TXIN < VCC V300 TOUT V- < VTOUT < V+
Charge Pump
An equivalent circuit of the charge pump is illustrated in Figure 1. The charge pump contains two sections: the voltage doubler and the voltage inverter. Each section is driven by a two phase, internally generated clock to generate +10V and -10V. The nominal clock frequency is 125kHz. During phase one of the clock, capacitor C1 is charged to VCC . During phase two, the voltage on C1 is added to VCC , producing a signal across C3 equal to twice VCC . During phase two, C2 is also charged to 2VCC , and then during phase one, it is inverted with respect to ground to produce a signal across C4 equal to -2VCC . The charge pump accepts input voltages up to 5.5V. The output impedance of the voltage doubler section (V+) is approximately 200, and the output impedance of the voltage inverter section (V-) is approximately 450. A typical application uses 0.1F capacitors for C1-C4, however, the value is not critical. Increasing the values of C1 and C2 will lower the output impedance of the voltage doubler and inverter, increasing the values of the reservoir capacitors, C3 and C4, lowers the ripple on the V+ and V- supplies. During shutdown mode (HIN206 and HIN211, SD = VCC , HIN213, SD = 0V) the charge pump is turned off, V+ is pulled down to VCC , V- is pulled up to GND, and the supply current is reduced to less than 10A. The transmitter outputs are disabled and the receiver outputs (except for HIN213, R4 and R5) are placed in the high impedance state.
FIGURE 2. TRANSMITTER
VCC RXIN -30V < RXIN < +30V GND 5k ROUT GND < VROUT < VCC
FIGURE 3. RECEIVER
Transmitters
The transmitters are TTL/CMOS compatible inverters which translate the inputs to RS-232 outputs. The input logic threshold is about 26% of VCC , or 1.3V for VCC = 5V. A logic 1 at the input results in a voltage of between -5V and V- at the output, and a logic 0 results in a voltage between +5V and (V+ - 0.6V). Each transmitter input has an internal 400k pullup resistor so any unused input can be left unconnected and its output remains in its low state. The output voltage swing meets the RS-232C specifications of 5V minimum with the worst case conditions of: all transmitters driving 3k minimum load impedance, VCC = 4.5V, and maximum allowable operating temperature. The transmitters have an internally limited output slew rate which is less than 30V/s. The outputs are short circuit protected and can be shorted to ground indefinitely. The powered down output impedance is a minimum of 300 with 2V applied to the outputs and VCC = 0V.
TIN OR RIN TOUT OR ROUT VOL VOL tPHL tPLH
AVERAGE PROPAGATION DELAY =
tPHL + tPLH 2 FIGURE 4. PROPAGATION DELAY DEFINITION
HIN213 Operation in Shutdown
The HIN213 features two receivers, R4 and R5, which remain active in shutdown mode. During normal operation the receivers propagation delay is typically 0.5s. This propagation delay may increase slightly during shutdown. When entering shut down mode, receivers R4 and R5 are not valid for 80s after SD = VIL. When exiting shutdown mode, all receiver outputs will be invalid until the charge pump circuitry reaches normal operating voltage. This is typically less than 2ms when using 0.1F capacitors.
8
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213 Typical Performance Curves
12 V- SUPPLY VOLTAGE (V) SUPPLY VOLTAGE (|V|) 0.1F 10 8 6 4 2 0 3.0 12 10 8 6 4 2 0 V- (VCC = 4V) TA = 25oC TRANSMITTER OUTPUTS OPEN CIRCUIT 0 5 10 15 20 25 V+ (VCC = 5V)
V+ (VCC = 4V)
V- (VCC = 5V)
3.5
4.0
4.5 VCC
5.0
5.5
6.0
30
35
|ILOAD| (mA)
FIGURE 5.
V- SUPPLY VOLTAGE vs VCC
FIGURE 6. V+, V- OUTPUT VOLTAGE vs LOAD
Test Circuits (HIN202)
+4.5V TO +5.5V INPUT 0.1F C3 0.1F C1 + + 1 C1+ 2 V+ 3 C10.1F + C2 0.1F C4 3k T2 OUTPUT RS-232 30V INPUT + 4 C2+ 5 C26 V7 T2OUT 8 R2IN VCC 16 GND 15 T1OUT 14 R1IN 13 R1OUT 12 T1IN 11 T2IN 10 R2OUT 9 3k T1 OUTPUT RS-232 30V INPUT TTL/CMOS OUTPUT TTL/CMOS INPUT TTL/CMOS INPUT TTL/CMOS OUTPUT ROUT = VIN /I T2OUT T1OUT VIN = 2V A 1 C1+ 2 V+ 3 C14 C2+ 5 C26 V7 T2OUT 8 R2IN VCC 16 GND 15 T1OUT 14 R1IN 13 R1OUT 12 T1IN 11 T2IN 10 R2OUT 9
FIGURE 7. GENERAL TEST CIRCUIT
FIGURE 8. POWER-OFF SOURCE RESISTANCE CONFIGURATION
Application Information
The HIN2XX may be used for all RS-232 data terminal and communication links. It is particularly useful in applications where 12V power supplies are not available for conventional RS-232 interface circuits. The applications presented represent typical interface configurations. A simple duplex RS-232 port with CTS/RTS handshaking is illustrated in Figure 9. Fixed output signals such as DTR (data terminal ready) and DSRS (data signaling rate select) is generated by driving them through a 5kW resistor connected to V+. In applications requiring four RS-232 inputs and outputs (Figure 10), note that each circuit requires two charge pump capacitors (C1 and C2) but can share common reservoir capacitors (C3 and C4). The benefit of sharing common reservoir capacitors is the elimination of two capacitors and the reduction of the charge pump source impedance which effectively increases the output swing of the transmitters.
9
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
+5V
+ 1 16 CTR (20) DATA TERMINAL READY DSRS (24) DATA SIGNALING RATE SELECT RS-232 INPUTS AND OUTPUTS TD (2) TRANSMIT DATA RTS (4) REQUEST TO SEND RD (3) RECEIVE DATA CTS (5) CLEAR TO SEND SIGNAL GROUND (7)
C1 + 0.1F C2 + 0.1F TD INPUTS OUTPUTS TTL/CMOS RTS RD CTS
3 HIN202 4 5 11 10 12 9 R2 R1 T1 T2 14 7 13 8 6
+
15
FIGURE 9. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS HANDSHAKING
1 C1 + 0.1F TD INPUTS OUTPUTS TTL/CMOS RTS RD CTS 9 R2 R1 3 11 10 12 HIN202 T1 T2
4 5 14 7 13 8 15 16 VCC + C3
-
+ C2 0.1F TD (2) TRANSMIT DATA RTS (4) REQUEST TO SEND RD (3) RECEIVE DATA CTS (5) CLEAR TO SEND
+
C4
6
2 V- V+
6
-
+5V RS-232 INPUTS AND OUTPUTS
0.2F
2 16 HIN202
0.2F VCC
1 C1 + 0.1F DTR INPUTS OUTPUTS TTL/CMOS DSRS DCD R1 9 R2 R1 3 11 10 12 T1 T2
4 5 14 7 13 8
-
+ C2 0.1F DTR (20) DATA TERMINAL READY DSRS (24) DATA SIGNALING RATE SELECT DCD (8) DATA CARRIER DETECT R1 (22) RING INDICATOR SIGNAL GROUND (7)
15
FIGURE 10. COMBINING TWO HIN202s FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS
10
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213 Die Characteristics
DIE DIMENSIONS: 160 mils x 140 mils METALLIZATION: Type: Al Thickness: 10kA 1kA SUBSTRATE POTENTIAL V+ PASSIVATION: Type: Nitride over Silox Nitride Thickness: 8kA Silox Thickness: 7kA TRANSISTOR COUNT: 238 PROCESS: CMOS Metal Gate
Metallization Mask Layout
HIN211
SHD
EN
R4IN
R4OUT T4IN T3IN R5OUT
R5IN
R3OUT V-
C2R3IN T4OUT T3OUT C1T1OUT T2OUT V+ C1+
C2+
R2IN R2OUT T2IN T1IN R1OUT R1IN GND
VCC
11
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213 Dual-In-Line Plastic Packages (PDIP)
N E1 INDEX AREA 12 3 N/2
E16.3 (JEDEC MS-001-BB ISSUE D)
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE INCHES SYMBOL
-B-
MILLIMETERS MIN 0.39 2.93 0.356 1.15 0.204 18.66 0.13 7.62 6.10 MAX 5.33 4.95 0.558 1.77 0.355 19.68 8.25 7.11 NOTES 4 4 8, 10 5 5 6 5 6 7 4 9 Rev. 0 12/93
MIN 0.015 0.115 0.014 0.045 0.008 0.735 0.005 0.300 0.240
MAX 0.210 0.195 0.022 0.070 0.014 0.775 0.325 0.280
A
E A2 L A C L
-AD BASE PLANE SEATING PLANE D1 B1 B 0.010 (0.25) M D1 A1
A1 A2
-C-
B B1 C D D1 E
eA eC
C
e
C A BS
eB
NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
E1 e eA eB L N
0.100 BSC 0.300 BSC 0.115 16 0.430 0.150
2.54 BSC 7.62 BSC 2.93 16 10.92 3.81
12
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213 Small Outline Plastic Packages (SOIC)
N INDEX AREA H E -B1 2 3 SEATING PLANE -AD -CA h x 45o 0.25(0.010) M BM
M16.15 (JEDEC MS-012-AC ISSUE C) 16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
INCHES SYMBOL A A1 B MIN 0.053 0.004 0.014 0.007 0.386 0.150 MAX 0.069 0.010 0.019 0.010 0.394 0.157 MILLIMETERS MIN 1.35 0.10 0.35 0.19 9.80 3.80 MAX 1.75 0.25 0.49 0.25 10.00 4.00 NOTES 9 3 4 5 6 7 8o Rev. 1 02/02
L
C D E e H h
C
0.050 BSC 0.228 0.010 0.016 16 0o 8o 0.244 0.020 0.050
1.27 BSC 5.80 0.25 0.40 16 0o 6.20 0.50 1.27
e
B 0.25(0.010) M C AM BS

A1 0.10(0.004)
L N
NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width "B", as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
13
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213 Small Outline Plastic Packages (SOIC)
N INDEX AREA E -B1 2 3 SEATING PLANE -AD -CA h x 45o H 0.25(0.010) M BM
M16.3 (JEDEC MS-013-AA ISSUE C)
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A
L
MILLIMETERS MIN 2.35 0.10 0.33 0.23 10.10 7.40 MAX 2.65 0.30 0.51 0.32 10.50 7.60 NOTES 9 3 4 5 6 7 8o Rev. 0 12/93
MIN 0.0926 0.0040 0.013 0.0091 0.3977 0.2914
MAX 0.1043 0.0118 0.0200 0.0125 0.4133 0.2992
A1 B C D E

A1 0.10(0.004) C
e H h L N
0.050 BSC 0.394 0.010 0.016 16 0o 8o 0.419 0.029 0.050
1.27 BSC 10.00 0.25 0.40 16 0o 10.65 0.75 1.27
e
B 0.25(0.010) M C AM BS
NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width "B", as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
14
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213 Small Outline Plastic Packages (SOIC)
N INDEX AREA E -B1 2 3 SEATING PLANE -AD -CA h x 45o H 0.25(0.010) M BM
M24.3 (JEDEC MS-013-AD ISSUE C)
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A
L
MILLIMETERS MIN 2.35 0.10 0.33 0.23 15.20 7.40 MAX 2.65 0.30 0.51 0.32 15.60 7.60 NOTES 9 3 4 5 6 7 8o Rev. 0 12/93
MIN 0.0926 0.0040 0.013 0.0091 0.5985 0.2914
MAX 0.1043 0.0118 0.020 0.0125 0.6141 0.2992
A1 B C D E

A1 0.10(0.004) C
e H h L N
0.05 BSC 0.394 0.010 0.016 24 0o 8o 0.419 0.029 0.050
1.27 BSC 10.00 0.25 0.40 24 0o 10.65 0.75 1.27
e
B 0.25(0.010) M C AM BS
NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width "B", as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
15
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213 Shrink Small Outline Plastic Packages (SSOP)
N INDEX AREA E -B1 2 3 L SEATING PLANE -AD -CA 0.25 0.010 GAUGE PLANE H 0.25(0.010) M BM
M24.209 (JEDEC MO-150-AG ISSUE B)
24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A A1 A2 B C D MIN 0.002 0.065 0.009 0.004 0.312 0.197 0.072 0.014 0.009 0.334 0.220 MAX 0.078 MILLIMETERS MIN 0.05 1.65 0.22 0.09 7.90 5.00 MAX 2.00 1.85 0.38 0.25 8.50 5.60 NOTES 9 3 4 6 7 8o Rev. 1 3/95

A1 0.10(0.004) A2 C
E e H L N
e
B 0.25(0.010) M C AM BS
0.026 BSC 0.292 0.022 24 0o 8o 0.322 0.037
0.65 BSC 7.40 0.55 24 0o 8.20 0.95
NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension "B" does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of "B" dimension at maximum material condition. 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
16
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213 Small Outline Plastic Packages (SOIC)
N INDEX AREA E -B1 2 3 SEATING PLANE -AD -CA h x 45o H 0.25(0.010) M BM
M28.3 (JEDEC MS-013-AE ISSUE C)
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A A1
L
MILLIMETERS MIN 2.35 0.10 0.33 0.23 17.70 7.40 MAX 2.65 0.30 0.51 0.32 18.10 7.60 NOTES 9 3 4 5 6 7 8o Rev. 0 12/93
MIN 0.0926 0.0040 0.013 0.0091 0.6969 0.2914
MAX 0.1043 0.0118 0.0200 0.0125 0.7125 0.2992
B C D E

A1 0.10(0.004) C
e H h L N
0.05 BSC 0.394 0.01 0.016 28 0o 8o 0.419 0.029 0.050
1.27 BSC 10.00 0.25 0.40 28 0o 10.65 0.75 1.27
e
B 0.25(0.010) M C AM BS
NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width "B", as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
17
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213 Shrink Small Outline Plastic Packages (SSOP)
N INDEX AREA E -B1 2 3 L SEATING PLANE -AD -CA 0.25 0.010 GAUGE PLANE H 0.25(0.010) M BM
M28.209 (JEDEC MO-150-AH ISSUE B)
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A A1 A2 B C D MIN 0.002 0.065 0.009 0.004 0.390 0.197 MAX 0.078 0.072 0.014 0.009 0.413 0.220 MILLIMETERS MIN 0.05 1.65 0.22 0.09 9.90 5.00 MAX 2.00 1.85 0.38 0.25 10.50 5.60 NOTES 9 3 4 6 7 8o Rev. 1 3/95

A1 0.10(0.004) A2 C
E e H L N
e
B 0.25(0.010) M C AM BS
0.026 BSC 0.292 0.022 28 0o 8o 0.322 0.037
0.65 BSC 7.40 0.55 28 0o 8.20 0.95
NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension "B" does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of "B" dimension at maximum material condition. 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
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